managed NAND

Ultra-fast UFS

UFS (universal flash storage) is a high-performance storage interface purpose-built for smartphones, automotive and computing systems that requires low power consumption, high performance and consistent reliability.




Extending UFS 4.0 mobile storage leadership

World’s most compact UFS package size1 designed for use in next-generation smartphones. Offering new proprietary firmware features to accelerate AI experience on smartphones.

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UFS 4.0 Infographic

Learn more about UFS 4.0 storage solutions, including new firmware features and specifications that accelerate AI use cases at the edge.

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UFS 3.1 and previous generations

The Micron UFS 3.1 client storage device delivers industry-leading storage densitiesto enable flexible OEM designs that provide an optimal user experience for value-focused client platforms.

Benefits for mobile

UFS is the ideal interface for next-gen mobile devices, and here’s why:


Enables much quicker load times for applications and files as well as faster device boot-up compared to e.MMC 5.1.

Multi-tasking responsiveness

Provides a seamless experience when switching between multiple applications due to lower UFS latencies.

Camera performance

Enables a significant increase in performance over e.MMC 5.1 when shooting bursts of photos or multiple photo stitches like panoramas due to higher memory interface bandwidth.

Richer content

Enables seamless HD streaming and more graphically rich content (like in gaming) thanks to the faster read/write performance with UFS.

Micron’s mobile solutions

Learn more about Micron’s mobile memory and storage solutions, and the latest UFS 4.0, purpose-built for mobile.

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Automotive benefits

UFS enhances in-vehicle infotainment systems and instrument clusters in connected vehicles with its many benefits like these:

Superior performance

Enables up to 941 MB/s reads and 651 MB/s writes, which means almost 3X faster reads and more than 2X faster writes than e.MMC interfaces.

Expanded temps

Supports Automotive Electronics Council (AEC)-Q100 Grade 3 (–40°C to 105°C) and AEC-Q100 Grade 2 (–40°C to 95°C) temperature requirements.

High quality and reliability

Complies with AEC-Q100 and Internal Automotive Task Force 16949 standards.


Takes advantage of industry-leading 64-layer triple-level-cell 3D NAND with CMOS under array technology.

Micron’s automotive solutions

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Client computing benefits

Micron UFS storage devices provide excellent performance with low power consumption and an outstanding thermal profile to deliver many benefits to client OEMs and end users:

Extends usable battery life

Due to 70% less power usage during active use and 66% less power usage during sleep mode than other Micron client SSDs.3 

Unprecedented PC design flexibility

Dime-size footprint allows 88% more PCB area than M.2 to enable more space for other hardware or features.4

Hours of untethered performance

Power efficiencies mean no thermal throttling due to overheating for prolonged productivity on the go.

Micron’s client computing solutions

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Resources & documentation

Comparing UFS and NVMe™ storage stack and system-level performance in embedded systems

We compare and quantify the differences between UFS and NVMe user-level storage performances, showing how these technologies offer great interface speeds by making use of the underlying speed of NAND technologies.

Automotive solutions

Micron is powering the automotive industry with leading, comprehensive automotive-qualified memory.

Search all resources and documentation

1As compared to publicly available UFS 4.0 products package sizes, 1TB only.

2Based on a survey of public material at the time of this document’s publication.

3Based of the datasheet power comparisons of the UFS FS194/195/196 versus that of the 2450 SSD.

4Based of the datasheet form factor comparisons of the UFS FS194/195/196 versus that of the 2450 SSD.

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Downloads & technical documentation

Resources to help you design, test, build and optimize your innovative designs.